High power ultraviolet UV LED COB chip on board 300W up 365nm 385nm 395nm 405nm - 160W G2 Ultimate - UV.Chingtek.net
  UV Technology - UV LED (Ultraviolet LED) - UV.Chingtek.net
Chingtek Electronics Corp.

Products to Order Photos of customers support contact
6-1
The UV-LED chips 320W by COB packing.
6-2
High power ultraviolet UV LED COB chip on board 100W up 365nm 385nm 395nm 405nm - 100W Spotlight 60D - UV.Chingtek.net
6-3
The UV-LED chips 20W by COB packing.

UV LED - 160W G2 Ultimate - COB type

(UVA 365nm - 415nm )


High power ultraviolet UV LED COB chip on board 300W up 365nm 385nm 395nm 405nm - 160W G2 Ultimate - UV.Chingtek.net

The Easiest installation Powerful High Power Board
to Start UV LED Curing!

The specially designed high heat dissipation,
well designed for high power UV LED operation!
 
E High heat dissipation brings more life span
E More current scaling potential with high power operation
E Easy start up for module/UV curing system design
 

High power ultraviolet UV LED COB chip on board 300W up 365nm 385nm 395nm 405nm - 160W G2 Ultimate - UV.Chingtek.net

How to install the UV LED unit into modules?

  You must need:
1. Air/Water cooling heat sink:
  The lower temperature you maintain on the COB board,
  the more intensity power you can run up to, along with longer life span.
2. UV LED power driver
  It's better with dimming function, but must be constant current supply.


Our customers project for reference !!

UV LED - 160W G2 Ultimate - COB type


High power ultraviolet UV LED COB chip on board 300W up 365nm 385nm 395nm 405nm - 160W G2 Ultimate - UV.Chingtek.net

  ----- Key Features -----
   
> 395nm irradiation intensity 8W/cm2~11W/cm2,

365nm irradiation intensity 4W/cm2~ 5W/cm2
> Board dimension of 56mm x 28mm, Basic power 160W With fine

heat dissipation , able to scale 320W (Need more cooling)
> Irradiation intensity scales high at higher current !
  (> 6 A operation) High thermal conductivity package
E Environmentally friendly: RoHS compliant, mercury-free
E Variable drive currents: less than 4.5A through 12A or higher
E Easy use for Linear UV light source
   


  ----- Applications -----
   
- Curing:
  > Inks > Coatings > Adhesives
- Inspection
- Machine Vision
- Fiber-coupled illumination
- Specialty Projection Systems for Maskless Lithography
- Rapid Prototyping and 3D printing
- Medical and Scientific Instrumentation
   

 

  Package Dimensions (mm) :

High power ultraviolet UV LED COB chip on board 300W up 365nm 385nm 395nm 405nm - 160W G2 Ultimate - UV.Chingtek.net

1.) LED Array : 8s20p
2.) Typical Voltage: 28V
3.) Operating Current: 6000mA
Notes: (1) All dimensions are in millimeters. (2) Tolerance is 0.25mm



Technology of Overviews
The COB Multi-chips LED package benefit from innovations in device technology, chip package and thermalmanagement. This suite of technologies give engineers and system designers the freedom to develop solutions both high in power and efficiency.
 
The Technology
 
Reliability Technology
our technology enables to emit large area photons uniformly over the entire COB UV LED surface. The intense optical power density produced by these multi-chips facilitate designs which replace mercury lamps where arrays of traditional power LEDs cannot.
  Designed from the ground up, the COB Multi-chips LEDs are one of the most reliable light sources in the world today. COB Multi-chips LEDs have passed a rigorous suite of environmental and mechanical stress tests, including mechanical shock, vibration, temperature cycling and humidity, and high current applications. With very low failure rates and median lifetimes that typically exceed 10,000 hours, the COB Multi-chips LEDs are ready for evern the most demanding applications.
 
For UV devices, the side-less structure to let the engineers easy to design the linear UV LED light source and instead of the linear mercury lamps with power density 80W/cm -120W/cm.  
     
Packaging Technology
 
Environmental Benefits
Thermal management is critical in high power LED applications. The UV LEDs have the lowest thermal resistance of any LED on the market with a thermal resistance from junction to heat sink of 0.3XC/W or 0.35XC/W. This allows the LED to be driven at higher current densities while maintaining a low junction temperature, thereby resulting in brighter solutions and longer lifetimes.   our LEDs help reduce power consumption and the amount of hazardous waste entering the environment. All COB Multi-chips LED products manufactured by us are RoHS compliant and free fo hazardous materials, including lead and mercury.
 


The Advantages of COB Multi-chips LEDs

Every LED is fully designed to ensure that it meets the high quality standards expected from our products.
>>> Low Thermal Resistance <0.16XC/W / High thermal conductivity 401W/(m.K)
  Copper Substrate and LED Chip Direct Bonding on Cu Base
   
>>> Special Reflecting Surface
  No Ag Plating, Anti-Sulfide, and Low Light Decay.
   
>>> Ni Coating at the Cu substrate bottom
  Anti-Oxidized and SMT Compatible.
   
The Advantages of COB Multi-chips LEDs



Electrical/Optical Characteristics (Ta=25XC)

Optical Characteristics (Ta=25XC)
Parameter
Symbol
Wavelength
Conditions
Min.
Typ.
Max.
Units
Irradiance Note[1]
Ee
365-370nm
IF=6000mA
1.5
2
-

W/cm2

370-380nm
2.0
2.5
-
380-390nm
3
3.4
-
390-410nm
4
5.5
-
View Angle
2c1/2
X-Axis
IF=6000mA
140
150
160
Degree
Y-Axis
120
130
140
Note: [1] Irradiance measured by DYMAX ACCU-CAL 50-LED Meter, and the distance of test is 5 mm.

Over Current Optical Characteristics (Ta=25XC)
Parameter
Symbol
Wavelength
Conditions
Min.
Typ.
Max.
Units
Irradiance Note[1]
Ee
365-370nm
IF=12000mA
-
4
-

W/cm2

370-380nm
-
5
-
380-390nm
-
6
-
390-410nm
-
8
-
Note: [1] Irradiance measured by DYMAX ACCU-CAL 50-LED Meter, and the distance of test is 5 mm.
[2] Recommended water cooling heatsink, with board temperature controlled around 40XC.


Electronic Characteristics (Ta=25XC)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Forward Voltage
VF
IF=6000mA
26
-
30

V

Reverse Current Note[1]
Ir
VR=5V
10

uA

Thermal Resistance
JunctionTo Board
RthJ-B
IF=6000mA
0.1
XC/W
Temperature
Coefficient of
Forward Voltage
GVF/GT
IF=6000mA
-64
-
mV/XC
Note: [1] Singe chip VR

Absolute Maximum Rating (Ta=25XC)
Parameter
Symbol
Conditions
Units
Power Dissipation
PD
360

W

Continuous Forward Current Note[1]
IF
12,000
mA
LED Junction Temperature
Tj
120
/XC
Operating Temperature Range
Topr
30J To +80J
Storage Temperature Range
Tstg
-40J To +100J
Manual Soldering Temperature
Tsol
260J20J For 3-5 Seconds
ESD Sensitivity Note[2]
ESD
500V HBM
Note: [1] Recommended water cooling heatsink, with board temperature controlled around 40XC.
[2] Singe chip ESD.


Optical & Electric Characteristics

Relative Power vs Distance (at central point ), I F =6000mA

Relative Power vs Distance (at central point ), I F =6000mA


Relative Power vs X-Axis , I F =6000mA
Relative Power vs X-Axis , I F =6000mA


Relative Power vs Y-Axis , I F =6000mA
Relative Power vs Y-Axis , I F =6000mA



Relative Power vs Forward Current (IF)
Relative Power vs Forward Current (IF)



Relative Power vs Board Temperature (Tb )
Relative Power vs Board Temperature (Tb )



Forward Voltage vs Board Temperature (Tb )
Forward Voltage vs Board Temperature (T b )






UV COB LED Reliability

UC-160-VH (B50,L70) Lifetimes @ IF=6000mA
UV COB LED Reliability


UV COB LED Spectrum Distribution

UV COB LED Spectrum Distribution



Assembly Notice

1) Do not touch emitting area.
- Do not touch or scratch silicon forming matrix area since it could damage the bonding
 

of LED chipsor wires and cause dead zone.

 
Dont touch the surface of Emitter
Dont touch the surface of Emitter
   
2.) Assembly guideline
  Wiring emitters anode/cathode pad, then fix emitter with screws onto heat sink.
 
Dont touch the surface of Emitter Dont touch the surface of Emitter
   
3.) Soldering methods
  a) Set up the temperature of welding head to 40010J when soldering.
  b) Put Emitter on a 10010J hot plate and set up welding head temperature to 30010J
  c) Either is OK.
   
4.) Wires
  Suggested using strand wires (softer) to connect power, dont use solid wires.
   

Used Notice

1.) In order to avoid absorption of moisture, it is recommended that the products are sotred in the dry
  box (or desiccators) with a desiccants. Alternatively the following environment is recommended.
  Storage temperature: 5XC ~ 30XC , Humidity: 60% HR Max.
   
2.) Soldering rapidly cooling should be avoided.
   
3.) Products should not be assembly on distorted surface of heat sink.
   
4.) Products should not contact with any types of fluid, such as water, oil, organic solvents,...etc.
   
5.) The maximum ambient temperature should be taken into consideration when determining the
  operating current.
   
6.) This product must be driven by constant power supplier.
   
7.) ESD Precautions Static Electricity and surge damages LEDs. It is recommended that wrist bands
  or anti-electrostatic gloves be used when handing the LEDs. All devices, equipment, and
  machinery should be properly grounded.
   
8.) The appearance and specifications of product may be modified for improvement without notice.
   



Ordering Information

Color
Order Code
Peak
Wavelength (nm)
Light
Intensity (W/cm2 )@6000mA
Min
Max
Min
Max
UV
UVA-160-415VH
410
420
4
6
UVA-160-405VH
400
410
4
6
UVA-160-395VH
390
400
4
6
UVA-160-385VH
380
390
3
4
UVA-160-375VH
370
380
2
2.5
UVA-160-365VH
365
370
1.5
2





UV LED light wiht Hi-Power LED (UVA 400nm / 365nm ) - UV.Chingtek.net


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